I. Cleaning Pain Points in the Semiconductor Industry

Cleaning agents for clean and vacuum semiconductor environments face extremely high requirements. Conventional solvents have four major shortcomings:

• PFPE fluorinated greases are highly chemically inert, and conventional cleaning agents are difficult to fully dissolve them, leaving residues that continuously outgas and contaminate wafers

• Common solvents evaporate unevenly and are prone to leaving an organic film, which increases chamber pump-down time and equipment downtime costs

• Strong acids and high-polarity solvents can corrode plating layers and swell fluororubber, damaging the fit tolerance of precision components

• Most cleaning agents on the market have relatively high particulate and ionic impurity levels, creating secondary contamination after cleaning and failing to meet ISO cleanroom standards

To address these issues, FUCHS semiconductor cleaning agents are developed in conjunction with FUCHS vacuum lubrication systems, delivering an integrated cleaning-and-lubrication solution.

II. FUCHS Semiconductor Cleaning Agent Main Products and Features

Built on the RENOCLEAN precision cleaning product line, FUCHS semiconductor cleaning agents are divided into solvent-based, water-based, and energized cleaning categories. All are filled in ISO Class 7 cleanrooms and comply with SEMI (Semiconductor Equipment and Materials International) environmental requirements.

1. RENOCLEAN GMS 7205 energized cleaning agent for electrical applications

This FUCHS semiconductor cleaning agent supports online cleaning without equipment shutdown and is suitable for electrical contacts, sensors, and motor connectors. It has no flash point, stable insulation performance, and low surface tension, allowing it to penetrate micro-gaps and remove silicone grease and synthetic hydrocarbon films. It dries without residue and will not damage gold-plated contacts or engineering plastics, effectively reducing production-line downtime.

2. RENOCLEAN KU high-purity cleaning agent for fluorinated grease

Suitable for cleaning stubborn PFPE grease residues, this low-ionic, high-purity aliphatic hydrocarbon formulation offers strong solvency and is compatible with ultrasonic, immersion, and spray processes. After cleaning, its TML (Total Mass Loss) and CVCM (Collected Volatile Condensable Material) values are extremely low, so it will not contaminate vacuum chambers. It is widely used in bearing and chamber component rework processes.

3. RENOCLEAN MSA 3001 low-VOC (volatile organic compound) water-based cleaning agent

Suitable for pre-degreasing linear guides, valves, and metal parts in mass production, this low-foam product contains no harmful additives. It can be used with ultrasonic cleaning after dilution, and forms a short-term anti-rust film after cleaning. VOC-compliant, it is well suited for high-volume parts pretreatment processes.

4. RENOCLEAN GMS 7204 micro-component cleaning agent

Designed for probe stations and small vacuum sliding modules, it is compatible with soft rubber and various plating layers. It is suitable for low-loss mist cleaning and precise, localized chamber cleaning.

III. Typical Application Scenarios for FUCHS Semiconductor Cleaning Agents

1. Maintenance of wafer handling vacuum robots

For aged fluorinated grease on vacuum arms and transfer bearings, use RENOCLEAN KU ultrasonic cleaning to remove carbonized lubricant residues and restore the equipment’s low-outgassing performance; for mixed dust-and-grease contamination on linear guides, use RENOCLEAN GMS 7204 for wipe cleaning to maintain positioning accuracy.

2. Rework of vacuum chambers and valve seals

For organic exudates on chamber walls and O-rings, use RENOCLEAN GMS 7205 for online spray cleaning without full disassembly; fluororubber seals should be cleaned with a low-temperature water-based cleaning agent to avoid elastomer aging, and must be fully dried before assembly to prevent vacuum leakage.

3. Online maintenance of microelectronic contacts

For probe stations and electrical switches in test equipment, use the energized FUCHS semiconductor cleaning agent to quickly remove grease and oxide layers, stabilize contact resistance, and avoid equipment power-off and disassembly.

4. Pre-production cleaning of metal parts

For linear guides, bearings, and valves before shipment, use RENOCLEAN MSA 3001 for ultrasonic degreasing to reduce the risk of cutting fluids and anti-rust oils entering vacuum chambers at the source and lower the probability of later equipment contamination.