FUCHS TIMs thermal interface materials are engineered to efficiently dissipate heat, ensuring reliable, safe, and optimized performance of electronic components. TIMs fill the air gap between heat-generating components, like chips or PCBs, and heat-dissipating surfaces, such as heat sinks or chassis. High thermal conductivity enables efficient heat transfer and rapid dissipation from critical hot spots, enhancing device performance and reliability.
Unlocking the Benefits of FUCHS TIMs
FUCHS TIMS are recommended for electronic applications requiring heat dissipation across a wide range of industries, including Automotive, Data Centers, Consumer Electronics, Telecommunications, Semiconductor, and Defense. Typical applications include CPUs and GPUs, data storage modules, ADAS control systems, electronic control units, power electronics such as MOSFETs and IGBTs, as well as various consumer electronic devices.
FUCHS TIMs offers several performance benefits including:
Excellent Thermal Conductivity
High Dielectric Strength
High Temperature Stability
Wide Compatibility
Silicone-Free
Easy Dispensing
Which TIMs is Right for You?
Selecting the right thermal interface material is critical to ensuring optimal reliability and efficiency in your application. Here are some key factors to consider:
Reworkability
Greases and putties allow easy removal while epoxies and potting compounds are permanent.
Mechanical Stability
Putty and liquid gap fillers are soft and forgiving whereas epoxies introduce stress on sensitive components.
Automation Compatibility
All types of TIMs except pads support automated dispensing. Pads are ideal for manual, repeatable assembly lines.
Contamination Sensitivity
Silicone-based TIMs can outgas and form films that reduce adhesion, and affect coating quality. Non-silicone materials offer low outgassing to protect sensitive electronics, optics, and cleanroom applications.
Thermal Interface Materials from FUCHS
FUCHS offers a variety of thermal interface materials in various thermal conductivities, form factors and packaging options.
Our FUCHS TIM GREASE offers high thermal conductivity and excellent surface wetting capabilities at low bond line thickness, ensuring extremely low thermal interfacial resistance for efficient heat transfer. These cost-effective greases are suitable for various application methods including screen printing and automated dispensing.
Key features:
- Non-silicone & silicone formulations
- NSF-registered, food-grade variants
- TIM 700 Series: Electrically conductive greases formulated with high-purity silver and advanced resins, designed for microelectronics and high-temperature stability up to 150 °C for 1000+ hours.
Product | Type | Temperature Range (°C) | Color | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM GREASE 4060 | Non-Silicone | -55 to 200 | Grey | 450 | 2.4 | 6 | 2.8 | 109 | Screen printable grease. |
FUCHS TIM GREASE 611HTC | Non-Silicone | -55 to 360 | Grey | 150 | 3.2 | 3.2 | 3 | 1010 | Grease with high temperature stability. |
FUCHS TIM GREASE 618 | Non-Silicone | -55 to 360 | Grey | 60 | 2.3 | 1.2 | 16 | 1014 | Low outgassing grease with high temperature stability. |
FUCHS TIM GREASE 710NS | Non-Silicone | -55 to 200 | Silver | 500 | 4 | 7 | N/A | 102 | Highly electrically & thermally conductive paste recommended for EMI & electrical contacts/grounding. |
FUCHS TIM EJC 745SL | Silicone | -55 to 200 | Grey | Pent 250-300 | - | 1 | N/A | - | Very tacky, thermally conductive grease that prevents oxidation & resists corrosion. |
FUCHS TIM GREASE 510 | Silicone | -55 to 200 | White | 150 | 2.2 | 0.8 | 15 | 1014 | Screen printable, food grade grease with NSF approval & low bond line thickness. |
The FUCHS TIM 800 series features thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non-silicone resins. These materials are ideal for die-to-heat sink bonding, and surface-mount applications.
Key features:
- High thermal conductivity, mitigates localized hot spots
- Minimized mechanical stress on CTE (Co-efficient of thermal expansion) sensitive components due to low epoxy shrinkage
- Improves thermal management and improving operational efficiency.
- Available in one part, two parts, heat curable, and room temperature cure systems.
Product | Type | Temperature Range (°C) | Color | Mixed Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM EPOXY 816HTC | Heat Cure | -55 to 200 | Grey | 80-120 | 1.7 | 2.7 | 16 | 1011 | Two part epoxy with RT cure, high thermal conductivity, and high bond strength. |
FUCHS TIM PUTTY is a one-part, ultra-soft, form-in-place, paste-type gap filler for sensitive components where minimal pressure can be applied including high frequency, compact devices.
Key features
- Enables uniform application across varying thicknesses with lower stress tolerance
- Easily conforms to and adheres to most surfaces, shapes, and sizes
- Non-silicone formulations available
- Engineered for automated dispensing
- Compatible with packaging configurations from 30 cc cartridges to 5-gallon pails
Product | Type | Temperature Range (°C) | Color | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM PUTTY 3W | Non-Silicone | -40 to 150 | White | 4,500 | 2.7 | 3.5 | 16 | 1014 | One part, tacky putty recommended for vertical applications. |
FUCHS TIM PUTTY 51W | Non-Silicone | -40 to 150 | Grey | 5,000 | 2.3 | 5.1 | 3.2 | 109 | One part putty with rapid heat transfer and zero stress to components. |
FUCHS TIM PUTTY 6W | Non-Silicone | -40 to 150 | Grey | 7,000 | 2.3 | 6 | 3.2 | 109 | One part putty with rapid heat transfer and zero stress to components. |
FUCHS TIM LGF are two-part, form-in-place, curable liquid gap fillers engineered for high-performance thermal management.
Key features
- Low modulus and high compressibility for excellent conformability
- Reliable mechanical stability under elevated thermal and mechanical stress.
- Available in thermally conductive, electrically insulating or conductive variants with room or elevated temperature cure profiles
- Accommodate devices with variable gaps, offering high stack-up tolerance for reliable coverage.
Product | Type | Temperature Range (°C) | Color | Mixed Viscosity 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM LGF 2030 | Silicone | -55 to 200 | Blue | 400* | 2.5 | 3.5 | 13 | 1012 | Two part liquid gap filler with low hardness and RT cure. |
FUCHS TIM LGF 2021NS | Non-Silicone | -55 to 150 | Green | - | 2.7 | 2.1 | 12 | 1012 | Two part liquid gap filler with low hardness and tacky cure. |
FUCHS TIM PC potting compounds are low viscosity, self-leveling, flowable epoxy filled resin systems.
Key features
- Superior thermal conductivity
- High dielectric insulation
- Mitigates hot spots and optimizes thermal performance of encapsulated devices.
- Low-shrinkage formulation reduces mechanical stress and risk of damage to sensitive components.
Product | Type | Temperature Range (°C) | Color | Mixed Viscosity 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM PC 8550TC | Silicone | -55 to 200 | Grey | 4 | 2.15 | 1.2 | 18 | 1015 | Two part re-workable potting compound with soft and flexible cure. |
FUCHS TIM PC 8850FT | Non-Silicone | -55 to 150 | Black | 50 | 2.35 | 1.6 | 18 | 1015 | Two part hard cure potting compound with long service life. |
FUCHS TIM PAD products are pre-cured pads engineered for clean, production-friendly applications.
Key benefits
- High thermal conductivity,
- Robust electrical insulation
- Superior conformability for improved interface sealing.
- Silicone and non-silicone formulations available
Product | Type | Temperature Range (°C) | Color | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM PAD 1106 | Silicone | -55 to 200 | Red | N/A | - | 6 | 14 | 1011 | Pad with high thermal conductivity. |
FUCHS TIM PAD HTC-16 | Silicone | -55 to 200 | Grey | N/A | - | 16 | 10 | 1011 | Pad for very high heat flux applications requiring rapid heat transfer. |