Timtronics was acquired by FUCHS. All former Timtronics products are now being sold under the FUCHS TIM brand.
FUCHS TIMs thermal interface materials are engineered to efficiently dissipate heat, ensuring reliable, safe, and optimized performance of electronic components. TIMs fill the air gap between heat-generating components, like chips or PCBs, and heat-dissipating surfaces, such as heat sinks or chassis. High thermal conductivity enables efficient heat transfer and rapid dissipation from critical hot spots, enhancing device performance and reliability.
Unlocking the Benefits of FUCHS TIMs
FUCHS TIMS are recommended for electronic applications requiring heat dissipation across a wide range of industries, including Automotive, Data Centers, Consumer Electronics, Telecommunications, Semiconductor, and Defense. Typical applications include CPUs and GPUs, data storage modules, ADAS control systems, electronic control units, power electronics such as MOSFETs and IGBTs, as well as various consumer electronic devices.
FUCHS TIMs offers several performance benefits including:
Excellent Thermal Conductivity
High Dielectric Strength
High Temperature Stability
Wide Compatibility
Silicone-Free
Easy Dispensing
Which TIMs is Right for You?
Selecting the right thermal interface material is critical to ensuring optimal reliability and efficiency in your application. Here are some key factors to consider:
Reworkability
Greases and putties allow easy removal while epoxies and potting compounds are permanent.
Mechanical Stability
Putty and liquid gap fillers are soft and forgiving whereas epoxies introduce stress on sensitive components.
Automation Compatibility
All types of TIMs except pads support automated dispensing. Pads are ideal for manual, repeatable assembly lines.
Contamination Sensitivity
Silicone-based TIMs can outgas and form films that reduce adhesion, and affect coating quality. Non-silicone materials offer low outgassing to protect sensitive electronics, optics, and cleanroom applications.
Thermal Interface Materials from FUCHS
FUCHS offers a variety of thermal interface materials in various thermal conductivities, form factors and packaging options.
Our FUCHS TIM GREASE offers high thermal conductivity and excellent surface wetting capabilities at low bond line thickness, ensuring extremely low thermal interfacial resistance for efficient heat transfer. These cost-effective greases are suitable for various application methods including screen printing and automated dispensing.
Key features:
- Non-silicone & silicone formulations
- NSF-registered, food-grade variants
- TIM 700 Series: Electrically conductive greases formulated with high-purity silver and advanced resins, designed for microelectronics and high-temperature stability up to 150 °C for 1000+ hours.
Product | Type | Temperature Range | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM GREASE 080HTNS | Non-Silicone | -55 to 360 °C | 200 | 3.0 | 0.8 | 15.0 | 1012 | High-temperature performance |
FUCHS TIM GREASE 080NS | Non-Silicone | -55 to 200 °C | 90 | 2.4 | 0.8 | 12.4 | 1012 | 1K |
FUCHS TIM GREASE 100NS-EJC | Non-Silicone | -40 to 150 °C | - | 2.3 | 1.0 | - | - | Electrically conductive joint compund |
FUCHS TIM GREASE 250NS | Non-Silicone | -55 to 200 °C | 400 | 2.2 | 2.6 | 2.8 | 107 | 1K |
FUCHS TIM GREASE 300HTNS | Non-Silicone | -55 to 360 °C | 150 | 3.5 | 3.2 | 3.0 | 108 | 1K. High-temperature performance |
FUCHS TIM GREASE 320NS | Non-Silicone | -60 to 150 °C | 120 | 2.7 | 3.2 | 11.0 | 1011 | 1K.Thin bondline |
FUCHS TIM GREASE 320NS-LO | Non-Silicone | -55 to 200 °C | 450 | 2.4 | 3.2 | 2.8 | 109 | 1K |
FUCHS TIM GREASE 080FG | Silicone | -55 to 200 °C | 150 | 2.2 | 0.8 | 15.0 | 1012 | 1K Food-grade |
FUCHS TIM GREASE 100 | Silicone | -55 to 200 °C | 150 | 2.3 | 1.0 | 15.0 | 1012 | High-temperature performance |
FUCHS TIM GREASE 100HTNS | Silicone | -55 to 300 °C | 600 | 2.9 | 1.0 | 14.0 | 1012 | High-temperature performance |
FUCHS TIM GREASE 150 | Silicone | -55 to 250 °C | 60 | 2.3 | 1.2 | 16.0 | 1012 | 1K |
FUCHS TIM GREASE 200 | Silicone | -55 to 200 °C | 40 | 2.0 | 2.0 | 16.0 | 1012 | 1K |
FUCHS TIM GREASE 200EC | Silicone | -55 to 250 °C | 100 | 2.1 | 2.2 | 2.8 | 107 | 1K |
FUCHS TIM GREASE 320 | Silicone | -60 to 180 °C | 130 | 2.7 | 3.2 | 11.0 | >1011 | 1K. Thin bondline |
FUCHS TIM GREASE 450 | Silicone | -60 to 180 °C | 104 | 2.7 | 4.5 | 11.0 | >1011 | 1K. Thin bondline |
FUCHS TIM GREASE 601 | Silicone | -60 to 180 °C | 104 | 2.7 | 6.0 | 11.0 | >1011 | 1K. High performance. Thin bondline |
FUCHS TIM GREASE 602 | Silicone | -60 to 180 °C | 300 | 3.3 | 6.0 | 8.0 | >1012 | Solvent-free. Thin bondline interface. |
Products from the FUCHS TIM TBOND line feature thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non-silicone resins. These materials are ideal for die-to-heat sink bonding, and surface-mount applications.
Key features:
- High thermal conductivity, mitigates localized hot spots
- Minimized mechanical stress on CTE (Co-efficient of thermal expansion) sensitive components due to low epoxy shrinkage
- Improves thermal management and improving operational efficiency.
- Available in one part, two parts, heat curable, and room temperature cure systems.
Product | Temperature Range | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Cure | Description |
FUCHS TIM TBOND 180NS | -55 to 200 °C | 1200 | 2.6 | 1.8 | 16.0 | 1013 | 1hr @ 125°C 30mins @ 150°C | 1K |
FUCHS TIM TBOND 270NS | -55 to 250 °C | 1000 | 2.1 | 2.7 | 12.5 | 1013 | 1hr @ 100°C | 1K |
FUCHS TIM TBOND 250NS | -55 to 250 °C | 1000 | 2.1 | 2.5 | 12.5 | 1013 | 1hr @ 100°C | |
FUCHS TIM TBOND 170NS | -55 to 160 °C | 250 | 1.7 | 2.7 | 16.0 | 109 | Heat Cure | 2K. RT curable |
FUCHS TIM TBOND 080NS | -55 to 150 °C | 600 | 2.3 | 0.8 | 12.5 | 1013 | 2hrs @RT + 2hrs @70C | Flame retardant |
FUCHS TIM TBOND 160NS-PC | -55 to 150 °C | 50 | 2.3 | 1.6 | 18.0 | 1013 | 2K Self-leveling | |
FUCHS TIM TBOND EH9 | -55 to 150 °C | - | - | - | - | - | Catalyst | EH9 Catalyst for epoxy compounds |
FUCHS TIM TBOND 220NS-PC | -40 to 120 °C | 170 / 167 | 2.6 | 2.2 | 14.0 | 1011 | 3.5hr @RT 1.5hr @ 40C 10min @ 80C | Fast cure. Self leveling |
FUCHS TIM PUTTY is a one-part, ultra-soft, form-in-place, paste-type gap filler for sensitive components where minimal pressure can be applied including high frequency, compact devices.
Key features
- Enables uniform application across varying thicknesses with lower stress tolerance
- Easily conforms to and adheres to most surfaces, shapes, and sizes
- Non-silicone formulations available
- Engineered for automated dispensing
- Compatible with packaging configurations from 30 cc cartridges to 5-gallon pails
Product | Type | Temperature Range | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM PUTTY 1300 | Silicone | -60 to 180 °C | 20000 | 3.3 | 13.0 | .012 | 1013 | 1K. High performance. Dispensable |
FUCHS TIM PUTTY 600 | Silicone | -60 to 180 °C | 15000 | 3.3 | 6.0 | 12.0 | 1013 | 1K. High performance |
FUCHS TIM PUTTY 800 | Silicone | -60 to 180 °C | 17000 | 3.4 | 8.0 | 12.0 | 1013 | 1K. High performance. Dispensable |
FUCHS TIM PUTTY 250NS | Non-Silicone | -55 to 200 °C | 4500 | 2.7 | 2.0 | 16.0 | 1012 | 1K. Highly conformable |
FUCHS TIM PUTTY 450NS | Non-Silicone | -55 to 200 °C | 4400 | 2.3 | 4.5 | 3.0 | 107 | 1K. Low stress. Compresssible |
FUCHS TIM PUTTY 500NS | Non-Silicone | -55 to 200 °C | 5000 | 2.3 | 5.1 | 3.2 | 107 | 1K. High performance |
FUCHS TIM PUTTY 600NS-VS | Non-Silicone | -55 to 200 °C | 5000 | 3.2 | 6.1 | 14.0 | 1010 | 1K. High performance. Electrically insulating |
FUCHS TIM PUTTY 700NS | Non-Silicone | -60 to 150 °C | 25000 | 3.4 | 7.0 | 12.0 | 1013 | 1K. High performance |
FUCHS TIM PUTTY 900NS | Non-Silicone | -60 to 150 °C | 25000 | 3.3 | 9.0 | 12.0 | 1013 | 1K. High performance |
FUCHS TIM PUTTY 300NS | Non-Silicone | -55 to 200 °C | 7000 | 2.5 | 3.5 | 14.0 | 1011 | 1K. Low stress. Compresssible |
FUCHS TIM LGF are two-part, form-in-place, curable liquid gap fillers engineered for high-performance thermal management.
Key features
- Low modulus and high compressibility for excellent conformability
- Reliable mechanical stability under elevated thermal and mechanical stress.
- Available in thermally conductive, electrically insulating or conductive variants with room or elevated temperature cure profiles
- Accommodate devices with variable gaps, offering high stack-up tolerance for reliable coverage.
Product | Type | Temperature Range (°C) | Apparent Viscosity (A/B) CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Cure | Description |
FUCHS TIM LGF 220 | Silicone | -60 - 200 °C | 120 / 110 | 2.2 | 2.2 | 8.0 | 1010 | 30mins @RT 1min @100C | Very soft. Curable |
FUCHS TIM LGF 300 | Silicone | -60 to 180 °C | 5.7 / 8 | 2.3 | 1.5 | 14.0 | 1014 | 2.0Hr @RT 15min @ 70C 1min @ 120C | Self leveling. Thermally conductive |
FUCHS TIM LGF 360 | Silicone | -60 to 200 °C | 130 / 130 | 3.0 | 3.6 | 8.0 | 1010 | 30 mins at RT | Fast cure. Thermally conductive |
FUCHS TIM LGF 500 | Silicone | -60 to 200 °C | 110 / 80 | 3.3 | 5.0 | 8.0 | 1010 | 45 mins @RT 1min @100C 0.5min @120C | Ultra-fast cure. Thermally conductive |
FUCHS TIM LGF 700 | Silicone | -60 to 200 °C | 315 / 285 | 2.8 | 7.0 | 8.0 | 1010 | 45 mins @RT 1min @100C 0.5min @120C | Ultra-fast cure. Thermally conductive |
FUCHS TIM LGF 200NS | Non-Silicone | -45 to 125 °C | 500 | 2.7 | 2.0 | 12.0 | 1010 | - | 2K. Curable |
FUCHS TIM LGF 300NS | Non-Silicone | Non-Silicone | - | 2.7 | 3.0 | 12.0 | 1010 | - | 2K Curable |
FUCHS TIM potting compounds are low viscosity, self-leveling, flowable epoxy filled resin systems.
Key features
- Superior thermal conductivity
- High dielectric insulation
- Mitigates hot spots and optimizes thermal performance of encapsulated devices.
- Low-shrinkage formulation reduces mechanical stress and risk of damage to sensitive components.
Product | Temperature Range | Apparent Viscosity CTM 014 5 rpm @ 25°C (Pa·s) | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Cure | Description |
FUCHS TIM TBOND 160NS-PC | -55 to 150 °C | 50 | 2.3 | 1.6 | 18.0 | 1013 | 2K. Self-leveling | |
FUCHS TIM TBOND 220NS-PC | -40 to 120 °C | 170 / 167 | 2.6 | 2.2 | 14.0 | 1011 | 3.5hr @RT 1.5hr @ 40C 10min @ 80C | Fast cure. Self leveling |
FUCHS TBOND EPOXY 250NSPC | -60 to 150 °C | 5 | 1.8 | 2.5 | 14.0 | 1011 | 1.0Hr @ 80C 35Hrs @ RT | Low viscosity. Low shrinkage. Self leveling |
FUCHS TIM PAD products are pre-cured pads engineered for clean, production-friendly applications.
Key benefits
- High thermal conductivity,
- Robust electrical insulation
- Superior conformability for improved interface sealing.
- Silicone and non-silicone formulations available
Product | Type | Temperature Range (°C) | Thickness | Specific Gravity ASTM D792 (g/mL) | Thermal Conductivity ASTM D5470 (W/m-K) | Breakdown Voltage ASTM D149 (KV/mm) | Volume Resistivity ASTM D257 (Ohm-cm) | Description |
FUCHS TIM EMI 200 | Silicone | -60 to 180 °C | 0.5 - 5 mm | 4.4 | 2.0 | - | 1010 | High frequency (>2.4Ghz). EMI Absorber |
FUCHS TIM EMI 300 | Silicone | -60 to 180 °C | 0.5 - 5 mm | 3.9 | 3.0 | - | 1010 | High frequency (>2.4Ghz). EMI Absorber |
FUCHS TIM EMI 400 | Silicone | -60 to 180 °C | 0.5 - 5 mm | 3.6 | 4.0 | - | 1010 | High frequency (>2.4Ghz). EMI Absorber |
FUCHS TIM EMI 500 | Silicone | -60 to 180 °C | 0.5 - 5 mm | 3.6 | 5.0 | - | 1010 | High frequency (>2.4Ghz). EMI Absorber |
FUCHS TIM EMI 600 | Silicone | -60 to 180 °C | 0.5 - 5 mm | 3.8 | 6.0 | - | 1010 | High frequency (>2.4Ghz). EMI Absorber |
FUCHS TIM PAD 1100CF | Silicone | -60 to 150 °C | 0.5 - 2.5 mm | 3.4 | 11.0 | 8.0 | 1010 | High performance. Low stress |
FUCHS TIM PAD 1500CF | Silicone | -60 to 150 °C | 0.5 - 2.5 mm | 3.3 | 15.0 | 8.0 | 1010 | Immersion cooling compatible. High performance |
FUCHS TIM PAD 180TS | Silicone | -60 to 180 °C | 0.10 mm 0.125 mm 0.15 mm | 1.5 | 1.8 | 12.0 | 1012 | High tear resistance. High stress resistance (> 150 psi). For sharp interfaces |
FUCHS TIM PAD 2000CF | Silicone | -60 to 150 °C | 0.5 - 2.5 mm | 3.3 | 20.0 | 8.0 | 1010 | Immersion cooling compatible. High performance |
FUCHS TIM PAD 200CF | Silicone | -60 to 180 °C | 0.5 - 5.0 mm | 2.1 | 2.0 | 11.0 | 1010 | Very high rebound. Soft |
FUCHS TIM PAD 200HR | Silicone | -60 to 180 °C | 0.25 / 0.30 mm | 2.6 | 2.0 | 9/10 | 1012 | Fiberglass enforced. High tear resistance. Thin film |
FUCHS TIM PAD 250HR | Silicone | -60 to 180 °C | 0.5 - 5 mm | 2.6 | 2.5 | 12.0 | 1011 | Ultra compressible TIM pad for large gaps |
FUCHS TIM PAD 250TS | Non-Silicone | -60 to 180 °C | 0.10 mm 0.125 mm 0.15 mm | 1.5 | 2.5 | 8.0 | 1012 | High tear resistance. High stress resistance (> 150 psi).For sharp interfaces |
FUCHS TIM PAD 300HR | Non-Silicone | -60 to 180 °C | 0.25 mm 0.30 mm 0.45 mm | 2.8 | 3.0 | 7.9 | 1012 | Fiberglass enforced. High tear resistance. Thin film |
FUCHS TIM PAD 400CF | Non-Silicone | -60 to 180 °C | 0.5 - 5 mm | 2.8 | 4.0 | 12.0 | 1010 | Very high rebound. Soft |
FUCHS TIM PAD 450HR | Non-Silicone | -60 to 180 °C | 0.25 - 0.45 mm | 2.8 | 4.5 | 6.0 - 11.0 | 1010 | High tear resistnace film for sharp interface |
FUCHS TIM PAD 500HR | Non-Silicone | -60 to 180 °C | 0.5 - 5 mm | 3.1 | 5.0 | 10.0 | 1010 | High tear resistance. For sharp interfaces |
FUCHS TIM PAD 600CF | Non-Silicone | -60 to 180 °C | 0.5 - 5 mm | 3.2 | 6.0 | 12.0 | 1010 | Ultra compressible. High performance |
FUCHS TIM PAD 800CF | Non-Silicone | -60 to 150 °C | 0.5 - 5 mm | 3.4 | 8.0 | 8.0 | >1010 | Ultra compressible. High performance |
FUCHS TIM PAD 1100NS | Non-Silicone | -60 to 125 °C | 0.5 - 5 mm | 3.3 | 9.0 | 8.0 | >1010 | High performance |
FUCHS TIM PAD 1300NS | Non-Silicone | -60 to 125 °C | 0.5 - 5 mm | 3.3 | 13.0 | 8.0 | >1010 | High performance |
FUCHS TIM PAD 1700NS | Non-Silicone | -60 to 125 °C | 0.5 - 5 mm | 3.3 | 17.0 | 8.0 | >1010 | High performance |
FUCHS TIM PAD 300NS | Non-Silicone | -60 to 125 °C | 0.5 - 5 mm | 2.6 | 3.0 | 16.0 | >1010 | High performance. Low modulus |
FUCHS TIM PAD 500NS | Non-Silicone | -60 to 125 °C | 0.5 - 5 mm | 3.2 | 5.0 | 8.0 | >1010 | High performance. Low modulus |